01 / STARTING MATERIAL
Quartz ingots / boules
Quartz blanks produced by flame fusion for cutting, machining and component fabrication.
View boule specifications ↓
QUARTZ BOULES & ETCHING RINGS
From the material.
To the precision part.
Quartz boules and semiconductor etching rings, made from a shared material and supplied for different fabrication needs.
02 / MACHINED COMPONENT
Quartz etching rings
Ring components machined from quartz boules for semiconductor etching applications.
View ring specifications ↓MATERIAL FORMAT
Quartz boule specifications
- Material composition
- Fused quartz (SiO₂)
- Diameter
- To your drawing
- Manufacturing process
- Flame fusion
- Format
- Solid boule or ingot; length specified in the agreed drawing.
- Fabrication options
- Blank cutting, ring machining and other quartz component fabrication.
FINISHED GEOMETRY
Etching ring specifications
- Base material
- Machined from the selected quartz boule grade
- Outside diameter
- 100–600 mm
- Application
- Semiconductor etching equipment
- Drawing requirements
- Inner diameter, thickness, shoulders and grooves are machined to the component drawing.
- Inspection requirements
- Dimensions, flatness, concentricity and surface-finish criteria are agreed for each part.
SHARED MATERIAL DATA
Shared quartz material.
Common material properties.
A boule and a ring made from the same grade share the material reference data. Finished-part dimensions, machining tolerances and operating performance are assessed separately.
Mechanical properties
| Density | 2.2 × 10³ kg/m³ |
|---|---|
| Mohs hardness | 6–7 |
| Poisson’s ratio | 0.17 |
| Tensile strength | 4.9 × 10⁷ Pa |
| Compressive strength | >1.1 × 10⁹ Pa |
| Flexural strength | 65–95 MPa |
| Torsional strength | 30 MPa |
Thermal properties
| Thermal expansion coefficient · 20–300°C | (5.2–5.8) × 10⁻⁷ K⁻¹ |
|---|---|
| Specific heat · 20°C | 749 J/(kg·K) |
| Thermal conductivity · 20°C | 1.38 W/(m·K) |
| Strain point | 1,070°C |
| Softening point | 1,670°C |
| Annealing point | 1,150°C |
Electrical properties
| Dielectric constant · 10 GHz | 3.74 |
|---|---|
| Loss factor · 500 MHz | <1 × 10⁻³ |
| Electrical resistivity · 20°C | 1 × 10¹⁶ Ω·m |
Typical properties from the latest supplied data, for reference rather than batch acceptance. Material selection and finished-part requirements are confirmed separately.
Typical impurity data ppm
| Element / group | Typical data A | Typical data B | Typical data C |
|---|---|---|---|
| Al | 0.1 | 8 | 18 |
| Li | 0.4 | 0.5 | 0.6 |
| B | 0.1 | 0.1 | 0.3 |
| Na | 0.09 | 0.6 | 1.5 |
| Mg | 0.01 | 0.1 | 0.3 |
| K | 0.03 | 0.5 | 0.5 |
| Ca | 0.45 | 0.6 | 0.8 |
| Ti | 0.08 | 0.1 | 2.0 |
| Fe | 0.2 | 0.35 | 0.6 |
| Co | 0 | 0 | 0.05 |
| Ni | 0.1 | 0.1 | 0.1 |
| Mn | 0.03 | 0.05 | 0.2 |
| Cu | 0.01 | 0.5 | 0.8 |
| OH | 10 | 15 | 15 |
Each column shows a complete data set from the supplied material information. OH is listed separately from metals. A reported zero follows the source data and does not prove absolute absence. Reporting limits and the material specification are confirmed before supply.
BOULE TO RING
High-purity material.
Precision-machined geometry.
- 01
Select the blank
Match the material grade and blank dimensions to the ring drawing.
- 02
Cut & machine
Produce the annular blank, then machine the inner and outer profiles and required shoulders.
- 03
Finish & inspect
Check the specified dimensions, surface condition and component requirements.
- Quartz etching ring
- Quartz cover ring
- Quartz window
- Upper edge ring
- Lower edge ring
- Quartz nozzle
- Quartz shield
- Quartz shutter
Quartz components for etching.
Quartz rings, windows, nozzles, shields and shutters manufactured to your drawing and surface requirements.
OTHER QUARTZ PRODUCTS
Additional components made to your drawing.
From quartz boule to a ring made for your process.
Share your material requirements and component drawing.