01 / STARTING MATERIAL
Quartz ingots / boules
Quartz blanks produced by flame fusion for cutting, machining and component fabrication.
View boule specifications ↓
QUARTZ BOULES & ETCHING RINGS
From the material.
To the precision part.
Quartz boules and semiconductor quartz etching rings. A shared material foundation, shaped for two distinct requirements.
02 / MACHINED COMPONENT
Quartz etching rings
Ring components machined from quartz boules for semiconductor etching applications.
View ring specifications ↓MATERIAL FORMAT
Quartz boule specifications
- Material composition
- Fused quartz (SiO₂)
- Diameter
- To your drawing
- Material route
- Flame fusion
- Format
- Solid boule / ingot; length confirmed to the agreed drawing.
- Processing direction
- Blank cutting, ring machining and other quartz component fabrication.
FINISHED GEOMETRY
Etching ring specifications
- Material foundation
- Machined from the selected quartz boule grade
- Outside diameter
- 100–600 mm
- Application
- Semiconductor etching equipment
- Drawing requirements
- Inner diameter, thickness, shoulders and grooves defined by the component drawing.
- Inspection requirements
- Dimensions, flatness, concentricity and surface finish agreed for the part.
SHARED MATERIAL DATA
One quartz foundation.
Material properties in common.
The same material reference applies to a boule and a ring machined from that grade. Finished-part dimensions, machining tolerances and service performance are evaluated separately.
Mechanical properties
| Density | 2.2 × 10³ kg/m³ |
|---|---|
| Mohs hardness | 6–7 |
| Poisson’s ratio | 0.17 |
| Tensile strength | 4.9 × 10⁷ Pa |
| Compressive strength | >1.1 × 10⁹ Pa |
| Flexural strength | 65–95 MPa |
| Torsional strength | 30 MPa |
Thermal properties
| Thermal expansion · 20–300°C | (5.2–5.8) × 10⁻⁷ K⁻¹ |
|---|---|
| Specific heat · 20°C | 749 J/(kg·K) |
| Thermal conductivity · 20°C | 1.38 W/(m·K) |
| Strain point | 1,070°C |
| Softening point | 1,670°C |
| Annealing point | 1,150°C |
Electrical properties
| Dielectric constant · 10 GHz | 3.74 |
|---|---|
| Loss factor · 500 MHz | <1 × 10⁻³ |
| Electrical resistivity · 20°C | 1 × 10¹⁶ Ω·m |
Typical properties from the latest supplied material data. These are reference values, not batch acceptance results; material selection and finished-part requirements are confirmed separately.
Typical impurity data ppm
| Element / group | Typical data A | Typical data B | Typical data C |
|---|---|---|---|
| Al | 0.1 | 8 | 18 |
| Li | 0.4 | 0.5 | 0.6 |
| B | 0.1 | 0.1 | 0.3 |
| Na | 0.09 | 0.6 | 1.5 |
| Mg | 0.01 | 0.1 | 0.3 |
| K | 0.03 | 0.5 | 0.5 |
| Ca | 0.45 | 0.6 | 0.8 |
| Ti | 0.08 | 0.1 | 2.0 |
| Fe | 0.2 | 0.35 | 0.6 |
| Co | 0 | 0 | 0.05 |
| Ni | 0.1 | 0.1 | 0.1 |
| Mn | 0.03 | 0.05 | 0.2 |
| Cu | 0.01 | 0.5 | 0.8 |
| OH | 10 | 15 | 15 |
Each column retains one complete data set. OH is listed separately from metal impurities. A reported zero is reproduced as supplied and does not establish an absolute absence; reporting limits and the selected material specification are confirmed before supply.
BOULE TO RING
Material continuity.
Controlled geometry.
- 01
Select the blank
Match the material grade and blank dimensions to the ring drawing.
- 02
Cut & machine
Produce the annular blank, then machine the inner and outer profiles and required shoulders.
- 03
Finish & inspect
Check the specified dimensions, surface condition and component requirements.
- Quartz etching ring
- Quartz cover ring
- Quartz window
- Upper edge ring
- Lower edge ring
- Quartz gas injector
- Quartz shield
- Quartz shutter
Quartz components for etching.
Quartz rings, windows, gas injectors, shields and shutters. Component geometry and surface requirements are matched to your drawing.
OTHER QUARTZ FORMATS
Additional components to drawing.
From quartz boule to your finished ring.
Share your material requirements and component drawing.